Use of Funds — Round A Snapshot
Focus: production expansion, pilot-ready hardware, go-to-market activation, and manufacturing readiness.
Prototypes & Eval Kits — 32%
FPGA/FW/AI — 24%
Manufacturing Prep & Tooling — 22%
GTM & Sales Enablement — 14%
Security & Compliance — 8%
Illustrative allocation; final budgets set per scope, partners, and co-development commitments.
Milestone Timeline — From NDA to Production
Standard path for partners across defense, intelligence, energy, telco, and enterprise; manufacturing and the AI Data Warehouse kick off as milestones are met.
Briefing
60-min exec + tech
Production
LRIP & rollouts
As pilots succeed, Round B manufacturing (including PCB) engages; Round C AI Data Warehouse activates with tenant suites. Executive Park build proceeds in parallel as demand materializes.